Precision lamination: The copper material after roughening and silver plating is precisely laminated with insulating materials such as prepreg under high temperature and high pressure to form the core structure of a multilayer board.
Bonding guarantee: During the lamination process, the "physical anchor points" provided by the roughened surface tightly bond with the resin, forming a strong mechanical interlock, thus ensuring long-term physical and electrical reliability between the layers within the PCB.
The core advantage of this production line lies in its ability to provide a platform that integrates reliable processes, precision manufacturing, efficient production, and intelligent management. It helps high-end manufacturing industries address reliability issues such as product stratification at their root, and effectively respond to diverse order demands.
Capacity leap: The production line has achieved continuous and large-scale production, which can increase the daily production capacity of a single line to thousands of units, with a capacity increase of over 30%.
Yield improvement: By digitizing and implementing closed-loop control of process parameters, the time required to trace product quality issues can be shortened from 48 hours in manual production lines to 2 hours. Full-process intelligent control: Integrating industrial robots and central control systems enables fully automated operations and real-time monitoring from material loading to product hanging.
Comprehensive cost optimization: Automated production reduces labor demand, and precise production line design (such as countercurrent rinsing) can save up to 70% of water used for cleaning.
Features:
Number of channels: 1~4 production channels
Product specifications: width 10~100mm, sheet thickness 0.08-1.5mm, length: 300mm (Max), plating area accuracy +0.075mm