Silver plated pressure plate wire for chip lead frame

To produce an integrated circuit component, in addition to the IC chip, it also requires lead frames, adhesive, gold wires, plastic packaging materials, etc., which go through multiple processes to complete. The main function of the lead frame is to provide mechanical support for the chip and serve as a conductive medium to connect external circuits of the IC, transmit electrical signals, and together with the packaging material, dissipate the heat generated during chip operation, becoming a key component in the IC.

In order to ensure the chip and wire bonding performance in the packaging process and form good diffusion bonding with the lead frame, the chip and wire bonding areas (inner lead pins and small islands) of the lead frame are generally required to be embossed and then silver plated on top. The silver plating layer on the lead frame is a functional coating, with strict requirements for the solderability, conductivity, and position of the coating; The size of the plated parts is small and the batch size is large, requiring the use of low-cost and high-efficiency electroplating production methods.

According to the different types of workpieces, lead frame electroplating can be divided into two categories: "roll to roll" and "sheet". Some lead frames are thicker or have small pin legs, which are prone to deformation when electroplated in roll form. Generally, they are first punched into sheet form and then partially silver plated on one side.

The following picture shows the on-site installation of silver plated pressure plate line for chip lead frame by our company from June 2022 to the customer's location. After one year of inspection, all indicators of the production line meet the customer's requirements and have been successfully completed.