Electroplating accuracy: Through the precise coordination of RING (mask) and belt, high-precision selective electroplating can be achieved, typically enabling precise control of the electroplating area within a range of 0.2mm.
Electroplating power supply: Some equipment is equipped with dual-pulse power supply, which can provide better plating quality than traditional DC power supply and meet high-end electroplating requirements.
Belt tension: This is a crucial mechanical parameter. For instance, in a specific model, the parameter is set to F≤3N (maximum 3 newtons), which is essential for stabilizing the material belt and ensuring precision in the plating area.
Plating type: This type of equipment is primarily used for gold plating, but it is also suitable for localized electroplating of other precious metals such as silver and palladium. It is widely applied in the manufacturing of precision components like electronic connectors.
Control system: Advanced models adopt a control method of "touch screen + PLC", which can display and automatically store process parameters in real time, enabling a highly automated production process.
Customized Processing: Most equipment manufacturers support customized design and manufacturing based on customers' electroplating products and process requirements.