The etching machine in the automated electroplating line has evolved from a simple chemical "corrosion tank" into a core process platform that integrates precision patterning, automated management, intelligent control, and green production. It not only precisely "prints" the design blueprint into products but also provides indispensable driving force for the refinement and intelligent transformation of modern electronic manufacturing industry with its ultimate precision, ultra-high efficiency, significant benefits, and reliable quality.
In the fields of semiconductor advanced packaging (such as CoWoS, 3D stacking) for manufacturing cutting-edge electronic products, high-frequency and high-speed AI server PCBs, as well as automotive electronics and high-end consumer electronics with extremely demanding requirements, etching machines play a crucial role as "enablers". With the explosion of demand for technologies such as high-density interconnect (HDI), substrate-like PCB (SLP), and advanced packaging in industries like AI, 5G, and new energy, etching machines are evolving towards higher uniformity, lower damage, and stronger compatibility. For instance, non-contact or Hybrid transmission solutions are being adopted to completely eliminate the risk of friction and scratching on materials.
According to real industry data on technological transformation, upgrading from a manual line to a fully automated line can increase production capacity from 480 square meters per shift to 1520 square meters per shift, achieving a more than threefold efficiency increase.