The fully automated intelligent vertical electroplating line has achieved comprehensive superiority over traditional electroplating production lines through vertical layout, continuous flow production, and precise parameter control. It perfectly integrates ultimate quality, high efficiency, high safety, high reliability, and low cost, and has become a key infrastructure for semiconductor advanced packaging, high-end PCB, automotive electronics, and other high-precision manufacturing fields to address challenging process issues and build core competitiveness.
Excellent uniformity and consistency: The automated system can precisely monitor and adjust parameters such as current density, temperature, and solution concentration in real time. Combined with advanced VCP technology, it ensures that the uniformity of the plating layer can reach over 90%. This effectively solves the common "pool effect" of traditional equipment, ensuring a high degree of consistency in the thickness of the plating layer across the entire board.
Efficient deep and blind hole filling and plating capability: By adopting advanced processes such as pulse electroplating and innovative gushing, it can easily complete electroplating tasks with an aspect ratio of up to 50:1. The excellent hole filling capability for micro-holes with diameters less than 30μm ensures that the finished product is free of voids, meeting the stringent requirements of high-end PCBs such as HDI boards, IC carrier boards, and advanced packaging.
Preventing abrasions and foreign matter contamination: The adoption of a non-immersive or unique point-contact transmission method avoids the abrasions and foreign matter re-adhesion issues caused by traditional horizontal lines contacting the board surface. The fully enclosed design also minimizes the introduction of external contaminants。